Research Output | Dar Al-hikmah Library | IIUM Only
This study examines evolution characteristics of inelastic strains and materials damage in Sn-4Ag-0.5Cu (SAC405) solder joints of a BGA package under cyclic mechanical stressing. For this purpose, a finite element model of the assembly under four-point bend test set-up is employed. Strain rate-dependent response of the solder is represented by Anan