Subject(s): Electronic packaging -- Congresses
Contents:Integration of liquid cooling thermal and thermomechanical design for the lifetime prediction of electrical power modules -- PBGA reliability study for automotive applications -- Adhesiveless flexible laminate in automotive under-the-hood electronics -- Correlation of themal cycles te
Subject(s): Social sciences -- Research Methodology | Interviewing in sociology | Social sciences -- Field work
Holdings:
,Book - General,Gombak Campus Library,General Collection,Open Shelf,H61.28 R859R 2010,Available,00011195153